In today’s fast-paced innovation landscape, not every product requires mass production, but every product does demand quality, consistency, and agility. High mix, low volume (HMLV) production is essential for manufacturers building a diverse range of electronic assemblies in smaller quantities. Whether it’s a lineup of product variants, frequent design iterations, or low-demand specialized PCB assemblies, HMLV enables flexibility without sacrificing production standards.
Foxtronics EMS excels in managing complexity, change, and customization. From handling diverse BOMs and varying circuit board layouts to accommodating mixed-technology assembly, we streamline every stage of HMLV PCBA production. Our engineering and production teams are experienced in balancing short-run agility with rigorous quality control, ensuring each unit is built to spec, regardless of how unique the build is.
With the combined strength of our group companies—Accutron, OSDA, CCK Automations, and Argo EMS—we offer purpose-built facilities, robust traceability, and highly responsive PCBA production capabilities. Whether you’re building 10 units or 1,000 across multiple configurations, we keep your project moving efficiently with scalable, repeatable results.
In electronics manufacturing, one size rarely fits all. Many manufacturers need to produce multiple configurations, limited-run prototypes, or specialized PCB assemblies without committing to high volumes.
High mix, low volume (HMLV) production meets this demand with flexibility, speed, and quality, making it a strategic advantage across industries.
Manufacturing a wide mix of products in low volumes demands speed, adaptability, and precision. Our HMLV model support rapid changeovers, accommodating diverse product variants and small batches while ensuring consistent quality across every build.
Foxtronics EMS enables efficient high mix, low volume (HMLV) PCBA manufacturing with quick setup changeovers and real-time process adjustments. Our configurable work cells, smart programming, and advanced process controls ensure seamless transitions between builds, maintaining speed, flexibility, and quality across short runs and complex assemblies.
Our production lines are optimized for quick transitions using modular fixtures, quick-change stencils, and flexible feeders, minimizing downtime between builds.
We run hybrid lines capable of handling assemblies that combine SMT and through-hole processes, making us ideal for varied BOMs and complex product configurations.
Close coordination between our supply chain and production teams enables streamlined handling of multiple SKUs. Through centralized sourcing and VMI programs, we reduce delays and ensure part availability, even for short runs.
Every unit, regardless of volume or variant, follows the same rigorous quality protocols, from first-article inspection (FAI) to Inline Automated Optical Inspection (AOI) and Functional Circuit Testing (FCT), ensuring consistent performance and full traceability.
High mix, low volume production at Foxtronics EMS combines agility with consistency. Our teams, systems, and facilities are built to manage frequent changeovers, complex instructions, and strict quality standards, without missing a step.
With decades of experience and industry certifications, Foxtronics EMS supports leading innovators in demanding sectors, delivering reliable PCB assembly for mission-critical products. Our certified quality systems, advanced manufacturing, and engineering expertise ensure we meet the unique technical requirements of every industry we serve.
High Mix, Low Volume (HMLV) production often raises important questions around scalability, speed, and cost-efficiency. Here are answers to some of the most frequently asked questions we hear from customers exploring HMLV solutions at Foxtronics EMS.
HMLV production typically involves a broad range of PCB assemblies or products produced in small to medium quantities. It emphasizes variety over volume and is ideal for applications like prototyping, pilot builds, and products with frequent design updates.
We utilize agile work cells, digital visual work instructions, and lean manufacturing principles to support quick transitions between product variants. This ensures minimal downtime between builds and high throughput even in low-volume runs.
We follow IPC Class 2 and Class 3 standards, use standardized process validation, automated optical inspection (AOI), and implement traceable quality control checkpoints at every stage of the build.
Yes. Through lean scheduling, strategic stock of common components, and engineering readiness, we offer fast turnarounds—even for complex, multi-variant builds.
We’re flexible. Whether it’s a small pilot batch of 10 boards or a limited series of 500, we tailor our production approach to your needs. We also scale with you as your volume grows.